Description
AMAT 0010-47763 – Bonded Monopolar Dual-Heated Electrostatic Chuck
Product Overview
The AMAT 0010-47763 is an Applied Materials electrostatic chuck (ESC) assembly used in semiconductor wafer-processing equipment. Available equipment and parts references identify it as a bonded monopolar dual-heated ESC, with 0041-39086 repeatedly associated with the same assembly. The component combines wafer electrostatic clamping with dual-zone thermal control, allowing the wafer to remain securely positioned while process temperature is managed across the chuck surface. A separate semiconductor-equipment service provider identifies this part as a 300 mm ESC, while marketplace records also associate it with Applied Materials equipment assemblies. Exact process-chamber compatibility, electrical ratings, heater specifications, and physical dimensions are not sufficiently documented in public sources, so these values should be confirmed against the equipment configuration and original manufacturer documentation before installation.
Technical Specifications
| Parameter | Value |
|---|---|
| Product Model | 0010-47763 |
| Manufacturer | Applied Materials (AMAT) |
| Product Type | Bonded monopolar dual-heated electrostatic chuck assembly |
| Wafer Size | 300 mm reference |
| ESC Configuration | Monopolar |
| Heating Configuration | Dual heated / dual-zone reference |
| Power | Application-specific; verify OEM specification |
| Communication / Protocol | Not applicable |
| Operating Temperature | Equipment-dependent |
| Mounting | Process-chamber integrated ESC assembly |
| Dimensions (HxWxD) | Verify by equipment and revision |
| Weight | Not publicly verified |
| Typical Interfaces | High-voltage chuck and heater connections; equipment-specific interfaces |
| Associated Part Number | 0041-39086 |
| Compliance | Verify against applicable Applied Materials equipment requirements |

AMAT 0010-47763
Key Features and Benefits
- Provides electrostatic wafer clamping during semiconductor processing.
- Monopolar chuck architecture supports controlled wafer retention through an electrostatic field.
- Dual-heated construction supports thermal management across the wafer support surface.
- Bonded construction integrates the functional layers into a single equipment assembly.
- Identified as a 300 mm ESC in semiconductor-equipment service records.
- The associated 0041-39086 reference can assist with cross-checking inventory and replacement records.
- Suitable for controlled spare-parts inventories supporting legacy or active wafer-processing tools.
Personally, I would verify the chuck diameter, heater zoning, connector configuration, and assembly revision before purchasing. An ESC can appear physically compatible while differing substantially in electrical characteristics or chamber integration.
Related Models
0041-39086 — Associated assembly reference repeatedly listed with this bonded monopolar dual-heated ESC.
0010-47763R — Refurbished or revision-style designation appearing in secondary equipment inventories for the same basic assembly.
300 mm ESC — Service references identify this part as a 300 mm electrostatic chuck used in Applied Materials semiconductor equipment.
6000-81031B — Equipment-related reference appearing alongside this ESC assembly in historical spare-part listings.
Installation and Maintenance
Before installation, verify the complete Applied Materials part number, assembly revision, wafer diameter, heater configuration, connector arrangement, and chamber compatibility. Inspect ceramic surfaces and electrical interfaces for contamination, cracks, arcing marks, or mechanical damage.
An ESC is a critical process-chamber component. Improper handling can affect wafer clamping, thermal uniformity, or high-voltage isolation. Follow the equipment manufacturer’s service procedure, ESD controls, contamination-control requirements, and high-voltage isolation procedures during replacement. After installation, perform the prescribed electrical, vacuum, temperature, and chuck-function checks before returning the tool to production.
Product Warranty
Warranty coverage depends on supplier, condition, refurbishment status, and purchase agreement. Confirm whether the assembly is OEM-new, unused, refurbished, tested, or used-as-is. For refurbished units, request test documentation, refurbishment scope, revision information, and available operating history where possible.
The AMAT 0010-47763 should be managed as a critical semiconductor-process consumable or equipment spare, with exact configuration verification completed before procurement or installation.
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